Career fair at TU Dresden, April 10, 2019

On Wednesday, April 10t, 2019 MicroNova will be present at the career fair "bonding" in Dresden. We are happy to offer students the opportunity to learn more about MicroNova as an employer.

The bonding career fair at the TU Dresden is an excellent platform to get in touch with promising students and junior staff. It is the largest event of its kind organized by students in the Dresden area and we are already looking forward to getting to know you all!

Meet us to find a suitable working student jobs, internship, trainee program or direct entry.



Technical University of Dresden
Bergstraße 64
01069 Dresden


Wednesday, April 10, 2019

Find more details here.


MicroNova AG
Unterfeldring 6
85256 Vierkirchen

Phone: +49 8139 9300-0
Fax: +49 8139 9300-80


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MicroNova AG
Unterfeldring 6
85256 Vierkirchen

    +49 8139 9300-0

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